The Development Trend Of Tin Bismuth Alloy Solder

The ROHS instructions officially implemented in 2006: Strictly stipulate that the content of lead cannot exceed 0.1%. At the same time, other countries have successively implemented a lead-free bill, gradually prohibiting the use of lead in the electronics industry, and began to study leadless solder to instead of traditional Sn-Pb solder .

The currently recognized lead-free pimples that have the potential to replace the traditional lead-containing material include five alloy series: Sn-Bi, Sn-Zn, Sn-Ag, Sn-Cu, and Sn-Ag- Cu.Among them, Sn42Bi58 solder has the advantages of low melting point. As an ideal low -temperature welding material, they have a broader application prospect. It is mainly used for low -temperature welding of temperature -sensitive elements and some occasions with low temperature requirements.However, the Sn-Bi ingredients have the following shortcomings during service: because the inherent brittleness of Bi elements reduces the brittleness of the alloy.In addition, Bi is easy to ricate at high temperature, which makes plasticity and ductility poor, thereby reducing the mechanical properties of maternal alloy.
These are limited to further applications of Sn-Bi solder.