Our low melt indium, Indium alloy solder, galinstan are characterized by strong growth, short production cycle, fast update, high added value and strong market penetration. According to the company's competition and development strategy, we effectively allocate human resources, and timely promote our internal technology and human resources restructuring. We are committed to improving the quality of life and creating a harmonious living environment. Every leap of our company is achieved in pushing out new changes and technological progress.

Bismuth based alloy:

136F 58C

Description:

It is a bismuth-based eutectic fusible alloy made of four low-melting metals such as bismuth, tin, lead, and indium, without cadmium. It has a low melting point, can be melted in hot water, is easy to recycle and can be reused many times. Mainly used for welding and temperature control of concealed sprinkler decorative cover; fusible alloy sprinkler thermal element(instead of glass ball);the production of heat-sensitive components, etc.

To custom special specifications or specify the ratio, please feel free to contact us, we will reply as soon as possible.

We actively develop innovative M12 Waterproof Wire Connector Wire to Wire Field Assembly Thread Solder 2, 3, 4, 5, 6, 7, ... and solutions that meet our customers' needs, and inject new vitality into the transformation and upgrading of industries. Looking to the future, everything comes from professionalism and focus, we will continue to inject technological innovation and vitality for the development of the industry and the national economy. The company insists on the principle of win-win idea, has establishedglobal sales network and after-sales service network.